The time constant of logarithmic creep and relaxation

Materials Science and Engineering: A

Volumn 309-310, Issue , 2001, Pages 227-228

  Nabarro, F R N ^a,b  

^a UNIVERSITY OF THE WITWATERSRAND   (South Africa)

^b DSI CSIR Nanotechnology Innovation Centre   (South Africa)

Author keywords

Dislocation mechanism; Exhaustion mechanism; Logarithmic creep

Indexed keywords

ACTIVATION ENERGY; CREEP; DEFORMATION; HARDNESS; PARAMETER ESTIMATION; STRAIN HARDENING; STRESSES;

LOGARITHMIC VARIATION;

TIME MEASUREMENT;

CREEP; PLASTIC DEFORMATION; STRAIN; STRESS;

EID: 0035879880     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(00)01692-0     Document Type: Article

References (6)

1. Deformation-induced microstructures: Analysis and relation to properties