SCOPUS 정보 검색 플랫폼

Journal of Materials Processing Technology

Volumn 113, Issue 1-3, 2001, Pages 209-214

Measurement of the degree of cure of glass fiber-epoxy composites using dielectrometry

(4) Bang, Kyung Geun a Kwon, Jae Wook a Lee, Dai Gil a Lee, Jae Won b

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

b Samsung Heavy Industries (South Korea)

Author keywords

Degree of cure; Dielectric sensor; Dielectrometry; DSC; Glass fiber epoxy composite; Isothermal degree of cure; Thermosetting resin; Viscosity; Wheatstone bridge circuit

Indexed keywords

CURING; DIELECTRIC PROPERTIES OF SOLIDS; EPOXY RESINS; ISOTHERMS; THERMOSETS;

DIELECTROMETRY1;

GLASS FIBER REINFORCED PLASTICS;

EID: 0035876577 PISSN: 09240136 EISSN: None Source Type: Journal
DOI: 10.1016/S0924-0136(01)00657-4 Document Type: Conference Paper

Times cited : (63)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.