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Journal of Materials Science

Volumn 36, Issue 10, 2001, Pages 2391-2396

Weibull modulus of fracture strength of toughened ceramics subjected to small-scale contacts

(3) Gong, Jianghong a Si, Wenjie a Guan, Zhenduo a

a TSINGHUA UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CRACK INITIATION; CURVE FITTING; FRACTURE TOUGHNESS; GRINDING (COMMINUTION); RESIDUAL STRESSES; TOUGHENING;

WEIBULL MODULUS;

CERAMIC MATERIALS;

EID: 0035872579 PISSN: 00222461 EISSN: None Source Type: Journal
DOI: 10.1023/A:1017965628525 Document Type: Article

Times cited : (11)

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