Novel rapid-cure adhesives for low temperature using thiirane compound

Journal of Applied Polymer Science

Volumn 82, Issue 12, 2001, Pages 2953-2957

  Chino, Keisuke ^a   Suga, Kazuo ^a   Ikawa, Masahiro ^a   Satoh, Hajime ^a  

^a YOKOHAMA RUBBER CO LTD   (Japan)

Author keywords

Adhesives; Epoxy; Low temperature; Rapid cure; Thiirane (episulfide)

Indexed keywords

ADHESIVES; AMINES; CURING; LOW TEMPERATURE EFFECTS; VISCOSITY;

THIIRANE COMPOUNDS;

PHENOLIC RESINS;

ADHESIVE AGENT;

EID: 0035856721     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.2151     Document Type: Article

References (6)