The effect of metal oxide on the no-flow underfill fluxing capacity

Materials Science and Engineering: B

Volumn 85, Issue 1, 2001, Pages 64-69

  Chan, Y C ^a   Fan, S H ^a   Hung, K C ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Copper solder pad; Flip chip; Fluxing capacity; Metal oxide; No flow underfill; XPS

Indexed keywords

ACETONE; CATALYSIS; COPPER ALLOYS; COPPER PLATING; CURING; ELECTROPLATING; EUTECTICS; FLIP CHIP DEVICES; GOLD PLATING; HYDROCHLORIC ACID; SURFACE STRUCTURE; TIN ALLOYS; TIN COMPOUNDS; WETTING; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER SOLDER PADS; FLUXING CAPACITY; TIN OXIDE;

SOLDERING ALLOYS;

EID: 0035817438     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5107(01)00646-8     Document Type: Article

References (9)

1. Study of the fluxing agent effects on the properties of no-flow underfill materials for flip-chip applications
2. Characterization of a no-flow underfill encapsulant during the solder reflow process
3. Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability