Control of wafer temperature uniformity in rapid thermal processing using an optimal iterative learning control technique

Industrial and Engineering Chemistry Research

Volumn 40, Issue 7, 2001, Pages 1661-1672

  Lee, Kwang S ^a   Lee, Jinho ^a   Chin, Insik ^a   Choi, Jinhoon ^a   Lee, Jay H ^b  

^a Sogang University   (South Korea)

^b Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ITERATIVE METHODS; KALMAN FILTERING; LEARNING SYSTEMS; TEMPERATURE CONTROL;

ITERATIVE LEARNING CONTROL (ILC); RAPID THERMAL PROCESSING (RTP);

SILICON WAFERS;

SILICON;

ITERATIVE TECHNIQUE; PROCESS CONTROL; TEMPERATURE CONTROL;

ARTICLE; HEATING; LEARNING; LINEAR SYSTEM; PROCESS CONTROL; SEMICONDUCTOR; STATISTICAL MODEL; TEMPERATURE DEPENDENCE;

EID: 0035804559     PISSN: 08885885     EISSN: None     Source Type: Journal    
DOI: 10.1021/ie0005553     Document Type: Article

References (2)

1. Roozeboom, F. Manufacturing Equipment Issues in Rapid Thermal Processing; Academic Press: New York, 1992.
2. Badgwell, T. A.; Breedijk, T.; Bushman, S. G.; Butler, S. W.; Chatterjee, S.; Edgar, T. F.; Toprac, A. J.; Trachtenberg, I. Modeling and Control of Microelectronics Materials Processing. Comput. Chem. Eng. 1995, 19, 1.