Smart labels - High volume applications using adhesive flip-chip-technologies

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics: Incoperating POLY, PEP and Adhasives in Electronics

Volumn , Issue , 2001, Pages 304-308

  Kriebel, F ^a   Seidowski, Th ^a  

^a KSW Microtec GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; COST EFFECTIVENESS; ELECTRIC RESISTANCE; INVENTORY CONTROL; SUBSTRATES;

SMART LABELS;

FLIP CHIP DEVICES;

EID: 0035791518     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. Frost & Sullivan, Report 3583, 03/01
2. KSW patents: DE 199 05 807 A1, PCT/DE00/00417
3. KSW TempSense is a registered design owned by KSW Microtec GmbH