Mechanical and thermal properties of dense SiC/SiC composite fabricated by reaction-bonding process

Ceramic Engineering and Science Proceedings

Volumn 22, Issue 3, 2001, Pages 533-538

  Taguchi, T ^a   Igawa, N ^a   Yamada, R ^a   Futakawa, M ^a   Jitsukawa, S ^a  

^a JAPAN ATOMIC ENERGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CHEMICAL VAPOR DEPOSITION; COATINGS; COMPOSITION EFFECTS; DENSITY (SPECIFIC GRAVITY); FRACTURE; SCANNING ELECTRON MICROSCOPY; SILICON CARBIDE; STRENGTH OF MATERIALS; THERMAL DIFFUSION; VOLUME FRACTION;

CATASTROPHIC FAILURE BEHAVIOR; FIBER FABRICS; REACTION-BONDING PROCESS; STRENGTH DEGRADATION; STRESS DISPLACEMENT CURVES;

CERAMIC MATRIX COMPOSITES;

EID: 0035790238     PISSN: 01966219     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1002/9780470294680.ch61     Document Type: Conference Paper

References (7)

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