Development of ID-blade slicer monitoring system for cutting 12-inch silicon ingot

International Journal of Applied Electromagnetics and Mechanics

Volumn 15, Issue 1-4 SPEC, 2001, Pages 67-72

  Jiang, Zhongwei ^a   Fujiwara, Shusuke ^b   Chonan, Seiji ^b   Kawashima, Kazuo ^c  

^a YAMAGUCHI UNIVERSITY   (Japan)

^b TOHOKU UNIVERSITY   (Japan)

^c Asahi Diamond Industrial Co Ltd   (Japan)

Author keywords

12 inch wafer slicer; ID saw blade; Online monitoring system

Indexed keywords

DIGITAL FILTERS; INGOTS; PIEZOELECTRIC DEVICES; SEMICONDUCTOR DEVICES; SILICON WAFERS;

DIGITAL OSCILLOSCOPE; INNER DEFECT SAW BLADE CUTTING; ONLINE MONITORING SYSTEM; PIEZOELECTRIC SENSOR; THREE-BAND DIGITAL FILTERS;

METAL CUTTING;

EID: 0035789337     PISSN: 13835416     EISSN: None     Source Type: Journal    
DOI: 10.3233/jae-2002-429     Document Type: Article

References (3)

1. S.E. Forman and W.J. Rhines, it Vibration Characteristics of Crystal Slicing ID Saw Blade, J. Electrochemical Society 119 (1972), 686-690.
2. K. Ishikawa, H. Suwabw, M. Uneda and N. Kurata, Dynamical Study on ID-Blade Slicing Utilizing Elliptical Vibration: Mechanism of Elliptical Vibration Slicing and Behavior of Slicing Force, J. Japan Society for Precision Engineering 65(11) (1999), 1605-1610.
3. Z.W. Jiang, S. Chonan, K. Kawashima, K. Muto and W. Ichhara, Condition Monitoring of Sillicon-Wafer Slicer Cutting Crystal Ingots, Structural Health Monitoring, Technomic Publishing, 1997, pp. 624-635.