Estimation of printed circuit board power bus noise at resonance using a simple transmission line model

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2001, Pages 896-898

  Hu, H ^a   Hubing, T ^a   Van Doren, T ^a  

^a University of Missouri Rolla   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LOSSES; ELECTRIC LINES; ENERGY DISSIPATION; FREQUENCIES; RESONANCE;

TRANSFER COEFFICIENT;

PRINTED CIRCUIT BOARDS;

EID: 0035786851     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Istvan Novak, "Lossy Power Distribution Networks With Thin Dielectric Layers and/or Thin Conductive Layers," IEEE Transaction on Advanced Packaging, vol. 23, no. 3, pp. 353-360, August 2000.
3. th European Symposium on Electromagnetic Compatibility, vol. 1, Brugge, Belgium, pp. 643-647, Sept. 2000.
4. Jun Fan, Hao Shi, James L. Knighten, James L. Drewniak, 'DC Power Bus Modeling in High-speed Digital Designs Including Conductor and Dielectric Losses," Asia-Pacific Conference on Environmental Electromagnetic CEEM' 2000, pp. 126-131, May 3-7, 2000.
5. T. H. Hubing, J. L. Drewniak, T. P. Van Doren, D. M. Hockanson, "Power Bus Decoupling on Multilayer Printed Circuit Boards," IEEE Trans. Electromagnetic Compatibility, vol. 37, no. 2, May 2000.
6. Keunmyung Lee, Alan Barber, "Modeling and Analysis of Multichip Module Power Supply Planes," IEEE Trans. On Component, Packaging, and Manufacturing Technology, Part B, vol. 18, no. 4, pp. 628-639, Nov. 1995.
7. Istvan Novak, Larry Smith, Tanmoy Roy, "Low Impedance Power Planes with Self Damping," proceedings of the 2000 IEEE Conference on Electrical Performance of Electronic Packaging, pp. 123-126, 2000.