Grounding of heatpipe/heatspreader and heatsink structures for EMI mitigation

IEEE International Symposium on Electromagnetic Compatibility

Volumn 2, Issue , 2001, Pages 916-920

  Wang, C ^a   Drewniak, J L ^a   Knighten, J L ^b   Wang, D ^b   Alexander, R ^b   Hockanson, D M ^c  

^a University of Missouri Rolla   (United States)

^b NCR CORPORATION   (United States)

^c SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE DIFFERENCE METHOD; HEAT PIPES; HEAT SINKS; PRINTED CIRCUIT BOARDS; TIME DOMAIN ANALYSIS;

CAVITY MODES;

SIGNAL INTERFERENCE;

EID: 0035785991     PISSN: 01901494     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. th International Zurich Symposium on EMC 2001.
2. K. Li, C. F. Lee, S. Y. Poh, R. T. Shin, and J. A. Kong, "Application of FDTD method to analysis of electromagnetic radiation from VLSI heatsink configurations," IEEE Trans. Electromagn. Compat., vol. 35, no. 2, pp. 204-214, May 1993.
3. N. J. Ryan, D. A. Stone, and B. Chambers, "FDTD modeling of heatsinks for EMC," EMC York 99, International Conference and Exhibition on Electromagnetic Compatibility, pp. 125-130, July 1999.
4. S. Das and T. Roy, "An investigation on radiated emissions from heatsinks," IEEE International Symposium on EMC, vol. 2 pp.784-789, 1998.
5. I. Raza, "Containing emissions from a microprocessor module, "IEEE International Symposium on EMC, vol. 2, pp. 871-876, 2000.
6. J. P. Berenger, "Perfectly matched layer for the absorption of electromagnetic waves," J. Comput. Phys., vol. 114, pp. 185-200, Oct. 1994.
7. X. Ye, M. Koledintseva, M. Li, and J. L. Drewniak, "DC power-bus design using FDTD modeling with dispersive media and surface mount technology," accepted for publication in the IEEE Trans. Electromagn. Compat.
8. R. Luebbers, F. P. Hunsberger, K. S. Kunz, R. B. Standler, and M. Schneider, "A frequency-dependent finite-difference time-domain formulation for dispersive materials," IEEE Trans. Electromagn. Compat., vol. 32, pp222 - 227, Aug. 1990.
9. A. Taflove, Advances in Computational Electrodynamics: The Finite-Difference Time-Domain Method. Boston, MA: Artech House, 1998.
10. Y.-S. Tsuei, A. C. Cangellaris, and J. L. Prince, "Rigorous electromagnetic modeling of chip-to-package (first level) interconnections," IEEE Trans. Components Hybrids Manuf. Technol, vol. 16, pp. 876-882, Dec. 1993.
11. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, and T. P. Van Doren, "FDTD modeling of common-mode radiation from cables," IEEE Trans. Electromagn. Compat., vol. 38, pp. 376-387, Aug. 1996.
12. M. Li, "Modeling and design of shielding enclosures for EMI mitigation - experiments, and finite-difference time domain and method of moments modeling," Ph. D. Dissertation, University of Missouri-Rolla, 1999.
13. M. Li, J. Nuebel, J. L. Drewniak, T. H. Hubing, R. E. DuBroff, and T. P. Van Doren, "EMI from airflow aperture arrays in shielding enclosures - experiments, FDTD, and MOM modeling," IEEE Trans. Electromagn. Compat., vol. 42, pp. 265-275, August, 2000.