Enhancing thermal properties of W/Cu composites

Powder Metallurgy

Volumn 44, Issue 4, 2001, Pages 313-316

  Sampath, A ^a   Ravi, B G ^a   Nguyen, H ^a   Sudarshan, T S ^a  

^a MATERIALS MODIFICATION INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BLENDING; COMMINUTION; COPPER; DENSIFICATION; INORGANIC COATINGS; MICROSCOPES; SYNTHESIS (CHEMICAL); THERMAL CONDUCTIVITY OF SOLIDS; THERMAL EXPANSION;

MECHANICALLY BLENDED POWDERS;

METALLIC MATRIX COMPOSITES;

EID: 0035777432     PISSN: 00325899     EISSN: None     Source Type: Journal    
DOI: 10.1179/pom.2001.44.4.313     Document Type: Article

References (13)

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