Reliability of microelectromechanical systems (MEMS)

Proceedings of SPIE-The International Society for Optical Engineering

Volumn 4558, Issue , 2001, Pages 197-205

  Tadigadapa, Srinivas ^a,c   Najafi, Nader ^b  

^a PENNSYLVANIA STATE UNIVERSITY   (United States)

^b Integrated Sensing Systems Incorporated   (United States)

^c The Pennsylvania State University   (United States)

Author keywords

Biomedical Pressure Sensors; Capacitive Pressure Sensors; Microelectromechanical Systems; Packaging; Pressure Sensor Reliability; Reliability Testing

Indexed keywords

CHIP SCALE PACKAGES; FAILURE ANALYSIS; PARAMETER ESTIMATION; RELIABILITY; SENSORS; VACUUM APPLICATIONS;

PRESSURE SENSORS;

MICROELECTROMECHANICAL DEVICES;

EID: 0035767660     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.443002     Document Type: Article

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