Evaluating cure of a pMDI-wood bondline using spectroscopic, calorimetric and mechanical methods

Journal of Adhesion

Volumn 76, Issue 1, 2001, Pages 55-74

  Harper, David P ^a   Wolcott, Michael P ^a   Rials, Timothy G ^b  

^a Washington State University   (United States)

^b USDA FOREST SERVICE   (United States)

Author keywords

Dielectric analysis; Differential scanning calorimetry; Polymeric diphenylmethane diisocyanate; Saturated steam; Shear strength; Wood flakes

Indexed keywords

ADHESIVE JOINTS; BONDING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; ORGANIC POLYMERS; SHEAR STRENGTH; SPECTROSCOPIC ANALYSIS; STEAM; THERMAL EFFECTS;

LAP-SHEAR TESTS; MICRO-DIELECTRIC ANALYSIS;

WOOD PRODUCTS;

ADHESIVES; BONDING; CURING; POLYURETHANES; SHEAR STRENGTH; WOOD PRODUCTS;

EID: 0035761893     PISSN: 00218464     EISSN: None     Source Type: Journal    
DOI: 10.1080/00218460108029617     Document Type: Article

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