Integrated vacuum packaging for low-cost light-weight uncooled microbolometer arrays

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4369, Issue , 2001, Pages 235-239

  Cole, B E ^a   Higashi, R E ^a   Ridley, J A ^a   Wood, R A ^a  

^a HONEYWELL   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIREFLECTION COATINGS; BONDING; ELECTRONICS PACKAGING; ETCHING; HIGH TEMPERATURE OPERATIONS; IMAGE SENSORS; INFRARED IMAGING; OPTICAL PUMPING; PERFORMANCE; SILICON WAFERS; THERMAL CONDUCTIVITY OF SOLIDS; VACUUM APPLICATIONS;

INTEGRATED VACUUM PACKAGING; MICROBOLOMETERS; THERMAL CONDUCTION; THERMAL INFRARED SENSORS; WAFER SCALE PROCESS;

BOLOMETERS;

EID: 0035761031     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.445291     Document Type: Conference Paper

References (2)

1. Infrared Detectors and Emitters: Materials and Devices Chapter 7, Chapman and Hall 1999 Eds: Capper and Elliot 1999
2. B. Higashi, R.A. Wood, J. Ridley, Honeywell patent US 6,036,872