Fracture Aspects of Resin-Dentin Bonding in Non-trimming Microtensile Test

Dental Materials Journal

Volumn 20, Issue 4, 2001, Pages 315-324

  Chen, Ker Kong ^a   Shono, Yasuo ^a   Ogawa, Takao ^a   Kozono, Yoshio ^a   Terashita, Masamichi ^a  

^a KYUSHU DENTAL COLLEGE   (Japan)

Author keywords

Failure mode; Non trimming microtensile test; Resin dentin bonding

Indexed keywords

BISPHENOL A BIS(2 HYDROXYPROPYL) ETHER DIMETHACRYLATE; CLEARFIL AP X; CLEARFIL AP-X; CLEARFIL LINER BOND 2; DENTIN BONDING AGENT; METHACRYLIC ACID DERIVATIVE; RESIN; RESIN CEMENT; SILICON DIOXIDE; SINGLE BOND; Z100 COMPOSITE RESIN; ZIRCONIUM;

ADHESION; ANALYSIS OF VARIANCE; ARTICLE; CHEMISTRY; COMPARATIVE STUDY; DENTAL ACID ETCHING; DENTAL BONDING; DENTIN; HUMAN; IMAGE PROCESSING; MATERIALS TESTING; MECHANICAL STRESS; SCANNING ELECTRON MICROSCOPY; STATISTICS; SURFACE PROPERTY; TENSILE STRENGTH; ULTRASTRUCTURE;

ACID ETCHING, DENTAL; ADHESIVENESS; ANALYSIS OF VARIANCE; BISPHENOL A-GLYCIDYL METHACRYLATE; COMPOSITE RESINS; DENTAL BONDING; DENTIN; DENTIN-BONDING AGENTS; HUMANS; IMAGE PROCESSING, COMPUTER-ASSISTED; MATERIALS TESTING; METHACRYLATES; MICROSCOPY, ELECTRON, SCANNING; RESIN CEMENTS; SILICON DIOXIDE; STATISTICS; STRESS, MECHANICAL; SURFACE PROPERTIES; TENSILE STRENGTH; ZIRCONIUM;

EID: 0035749272     PISSN: 02874547     EISSN: None     Source Type: Journal    
DOI: 10.4012/dmj.20.315     Document Type: Article

References (12)

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