Characterization of acoustomigration with on-wafer measurement system

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2001, Pages 153-156

  Raml, G ^a   Ruile, W ^a   Springer, A ^a   Weigel, R ^a  

^a JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC VARIABLES MEASUREMENT; ALUMINUM; ALUMINUM COMPOUNDS; COPPER; LITHIUM COMPOUNDS; METALLIC FILMS; OPTICAL MICROSCOPY; PIEZOELECTRIC MATERIALS; SUBSTRATES; TEMPERATURE; THERMAL EFFECTS;

ACOUSTOMIGRATION; ALUMINUM FILM; ARRHENIUS LAW; FREQUENCY CONTROLLED PROBING SYSTEM; PIEZOELECTRIC SUBSTRATE; TEMPERATURE DEPENDENCE; TIME TO FLIGHT CRITERION;

ACOUSTIC SURFACE WAVE DEVICES;

EID: 0035729096     PISSN: 10510117     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. A study of al-alloy electrodes for high power SAW filters
2. A novel test device to characterize SAW acoustomigration