300mm process integration for 0.13um generation with Cu/low-k interconnect technology

Technical Digest - International Electron Devices Meeting

Volumn , Issue , 2001, Pages 603-606

  Chang, W ^a   Chen, C C ^a   Lu, J C ^a   Liou, S J ^a   Tsai, W J ^a   Liu, S Y ^a   Lee, H J ^a   Wang, Y I ^a   Lin, H C ^a   Yeh, C H ^a   Linliu, K ^a   Chang, S Z ^a   Shen, S J ^a   Chen, L W ^a   Peng, S S ^a   Hung, S H ^a   Hsiao, Y L ^a   Hsieh, C N ^a   Li, C I ^a   Chang, M ^a   Lee, K H ^a   more..

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; COPPER; DRY ETCHING; LITHOGRAPHY; MOSFET DEVICES; STATIC RANDOM ACCESS STORAGE; TUNING;

INTERCONNECT TECHNOLOGY; OPTICAL PROCESS TUNING; WITHIN WAFER GAP FILL;

CMOS INTEGRATED CIRCUITS;

EID: 0035716694     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)