Effect of wetting at splat/substrate interface on the flattening behavior of a freely fallen droplet

International Journal of Materials and Product Technology

Volumn , Issue SPEC ISS. VOL.2, 2001, Pages 700-705

  Nishioka, Eiji ^a   Matsubara, Toshikazu ^a   Fukumoto, Masahiro ^a  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

Dynamic wetting; Freely fallen droplet; Splat morphology; Substrate temperature; Thermal spraying

Indexed keywords

COMPUTER SIMULATION; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); METALLOGRAPHIC MICROSTRUCTURE; MORPHOLOGY; SPRAYING; SUBSTRATES; THERMAL EFFECTS; WETTING;

THERMAL SPRAYS;

COPPER METALLOGRAPHY;

EID: 0035716384     PISSN: 02681900     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Splat behavior of plasma sprayed particles on flat substrate surface
2. Effect of substrate material on flattening behavior of plasma sprayed Ni particles
3. Flattening mechanism in thermal sprayed particle impinging on flat substrate
4. Flattening and solidification behavior of metal droplet on flat substrate, surface held at various temperatures
5. Remelting phenomena in the process of splat solidification
6. Splat formation and cooling of plasma-sprayed zirconia
7. Wetting: Statics and dynamics