Deformation behavior of Cu-based nanocomposite processed by severe plastic deformation

Materials Science and Engineering: A

Volumn 319-321, Issue , 2001, Pages 872-876

  Islamgaliev, R K ^a,d   Buchgraber, W ^b   Kolobov, Y R ^c   Amirkhanov, N M ^d   Sergueeva, A V ^d   Ivanov, K V ^c   Grabovetskaya, G P ^c  

^a INSTITUTE OF MECHANICS   (Russian Federation)

^b ARC SEIBERSDORF RESEARCH GMBH   (Austria)

^c INSTITUTE OF STRENGTH PHYSICS AND MATERIALS SCIENCE   (Russian Federation)

^d Birsk Branch of Federal State Budgetary Educational Establishment of Higher Education Bashkir State University   (Russian Federation)

Author keywords

Cu based composite; Deformation behavior; Electrical resistivity; Nanostructure; Severe plastic torsion straining

Indexed keywords

COPPER; CREEP; ELECTRIC CONDUCTIVITY OF SOLIDS; GRAIN SIZE AND SHAPE; MICROHARDNESS; NANOSTRUCTURED MATERIALS; PLASTIC DEFORMATION; STRAIN; THERMODYNAMIC STABILITY; TORSIONAL STRESS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

HIGH PRESSURE TORSION (HPT);

METALLIC MATRIX COMPOSITES;

COMPOSITE; COPPER; PLASTIC DEFORMATION;

EID: 0035707073     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(01)01073-5     Document Type: Article

References (7)