CPW high Q inductors on organic substrates

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 2001, Pages 105-108

  Dalmia, Sidharth ^a   Lee, Seock Hee ^a   Sundaram, Venky ^a   Min, Sung Hwan ^a   Swaminathan, Madhavan ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

High Q inductors; MCM L; Organic; PWB

Indexed keywords

CAPACITANCE; DIELECTRIC MATERIALS; ELECTRIC IMPEDANCE; INTERFACES (MATERIALS); METHOD OF MOMENTS; MICROSTRIP LINES; MICROWAVE INTEGRATED CIRCUITS; PERMITTIVITY; PRINTED CIRCUIT BOARDS; Q FACTOR MEASUREMENT; SUBSTRATES; WAVEGUIDES;

HIGH Q INDUCTOR; METAL TO DIELECTRIC INTERFACE ROUGHNESS; ORGANIC SUBSTRATE;

ELECTRIC INDUCTORS;

EID: 0035703101     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Process integration for low-cost system on a package (SOP) substrate
2. Modeling of embedded RF passives using coupled lines and scalable models
3. Scalable models for embedded passives
4. Design of high-Q inductors in MCM-L technology
5. Design and optimization of embedded RF filters