A low-power direct conversion receiver module for C-band wireless applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 3, Issue , 2001, Pages 567-570

  Matinpour, B ^a   Sutono, A ^a   Laskar, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BANDPASS FILTERS; CERAMIC MATERIALS; INSERTION LOSSES; INTEGRATED CIRCUIT MANUFACTURE; LOW TEMPERATURE OPERATIONS; MESFET DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM ARSENIDE; SUBSTRATES; THREE DIMENSIONAL; WIRELESS TELECOMMUNICATION SYSTEMS;

LOW-POWER DIRECT CONVERSION RECEIVER; LOW-TEMPERATURE CO-FIRED CERAMIC PROCESS; MULTILAYER CERAMIC PACKAGE; THREE-DIMENSIONAL FRONT-END FILTER;

SIGNAL RECEIVERS;

EID: 0035695357     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. A single-chip 900-MHz spread-spectrum wireless transceiver in 1-um CMOS-Part II: Receiver design
2. Even harmonic type direct conversion receiver ICs for mobile handsets: Design challenges and solutions
3. 5 GHz CMOS radio transceiver front-end chipset
4. A compact monolithic C-band direct conversion receiver
5. Development of three dimensional integrated bluetooth image reject filter
6. A C-band low power high dynamic range GaAs MESFET low noise amplifier
7. Low cost, plastic encapsulated mixers for C/X-band applications
8. Novel dc-Offset cancellation techniques for even-harmonic direct conversion receivers