Low-loss passive components on BCB-based 3-D MMIC technology

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2001, Pages 1881-1884

  Nishikawa, Kenjiro ^a   Sugitani, Suehiro ^a   Inoue, Koh ^a   Ishii, Takao ^a   Kamogawa, Kenji ^a   Piernas, Belinda ^a   Araki, Katsuhiko ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; ELECTRIC INDUCTORS; ELECTRIC LINES; INTEGRATED CIRCUIT MANUFACTURE; INTERCONNECTION NETWORKS; PASSIVE NETWORKS;

LOW-LOSS PASSIVE COMPONENTS; TRANSMISSION LOSS; TRENCH TYPE TRANSMISSION LINE;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0035689613     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Highly integrated three-dimensional MMIC technology applied to novel masterslice GaAs- and Si-MMIC's
2. Miniaturized millimeter-wave masterslice 3-D MMIC amplifier and mixer
3. A compact V-band 3-D MMIC single-chip down-converter using photosensitive BCB dielectric film
4. Three-diemensional passive circuit technology for ultra-compact MMIC's
5. Three-dimensional MMIC interconnect process using photosensitive BCB and STO capacitor