Analysis of differential vias in a multilayer parallel plate environment using a physics-based CAD model

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2001, Pages 2031-2034

  Abhari, Ramesh ^a   Eleftheriades, George V ^a   Van Deventer Perkins, Emilie ^a  

^a UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; COMPUTER WORKSTATIONS; ELECTROMAGNETIC WAVE POLARIZATION; EQUIVALENT CIRCUITS; FINITE DIFFERENCE METHOD; INTEGRATED CIRCUIT TESTING; MULTILAYERS; REFLECTOMETERS; SPURIOUS SIGNAL NOISE; TIME DOMAIN ANALYSIS;

DIFFERENTIAL VIAS; FINITE DIFFERENCE TIME DOMAIN SIMULATION; PARALLEL PLATE MODE; TIME DOMAIN REFLECTOMETRY; TRANSVERSE ELECTROMAGNETIC MODE;

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS;

EID: 0035689517     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Modeling differential via holes
2. Modeling of delta-I noise in digital electronic packaging
3. Via coupling within parallel rectangular planes
4. Study of the ground bounce caused by power plane resonances
5. Modeling of interconnections and isolation within a multilayered ball grid array package
6. Equivalent circuit for multiple vias in parallel plate environment
7. An equivalent circuit based on radial transmission line theory for multiple vias in a parallel plate environment