Efficient methods for modelling substrate coupling in mixed-signal integrated circuits

Electronics and Communication Engineering Journal

Volumn 13, Issue 6, 2001, Pages 237-248

  Singh, R ^a   Sali, S ^a   Woo, W L ^a  

^a Cadence Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DIGITAL SIGNAL PROCESSING; MIXER CIRCUITS; NUMERICAL METHODS; SPURIOUS SIGNAL NOISE; SUBSTRATES;

MIXED-SIGNAL CIRCUITS;

INTEGRATED CIRCUITS;

EID: 0035680006     PISSN: 09540695     EISSN: None     Source Type: Journal    
DOI: 10.1049/ecej:20010601     Document Type: Article

References (13)

1. Experimental results and modelling techniques for substrate noise in mixed-signal integrated circuits
2. Substrate crosstalk in BiCMOS mixed mode integrated circuits
3. Modelling of resistive and geometric discontinuities in microstrip interconnections on integrated circuits
4. Efficient modelling of substrate noise and coupling in mixed-signal SPICE designs
5. Blocking in a system on a chip
6. Coupling of fields to microstrip interconnects with discontinuities
7. On the response of stripline interconnects excited by external fields
8. SUBWAVE: A methodology for modelling digital substrate noise injection in mixed-signal ICs
9. Method for modelling substrate coupling in large chip designs