Reduction of residual stresses in medium density fibreboard. Part 2. Effects on thickness swell and other properties

Holzforschung

Volumn 55, Issue 1, 2001, Pages 73-81

  Van Houts, J ^a   Bhattacharyya, D ^a   Jayaraman, K ^a  

^a UNIVERSITY OF AUCKLAND   (New Zealand)

Author keywords

Internal bond strength; Medium density fibreboard; Residual stress; Tensile modulus; Tensile strength; Thickness swell; Wood fibre

Indexed keywords

BOND STRENGTH (MATERIALS); DIMENSIONAL STABILITY; ELASTIC MODULI; FIBERS; MOISTURE; PRESSURE; RESIDUAL STRESSES; TEMPERATURE; TENSILE STRENGTH;

SURFACE LAYER TENSILE MODULUS; SURFACE LAYER TENSILE STRENGTH; TAGUCHI METHOD; THICKNESS SWELL;

WOOD PRODUCTS;

BONDING STRENGTH; ELASTIC STRENGTH; HEAT; SOFTBOARDS; STRESSES; TENSILE STRENGTH; WOOD PRODUCTS;

EID: 0035677352     PISSN: 00183830     EISSN: None     Source Type: Journal    
DOI: 10.1515/HFSG.2001.73     Document Type: Article

References (9)

1. Standard test methods for evaluating properties of wood-base fiber and particle panel materials
2. Designing for quality. An introduction to the best of Taguchi and western methods of statistical experimental design
3. Curing conditions effects on the characteristics of thermosetting adhesive-bonded wood joints. Part 2: Hot postcuring improvement of UF particleboards and its temperature forecasting model
4. Hot stacking and its effects on panel properties
5. Determination of residual stresses in medium density fireboard
6. Reduction of residual stresses in medium density fibreboard. I. Taguchi Analysis
7. Modelling wood as a polymeric foam: An application to wood-based composite manufacture