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Volumn 61, Issue 16, 2001, Pages 2349-2359
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The relationships between wear behavior and thermal conductivity of CuSn/M7C3-M23C6 composites at ambient and elevated temperatures
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Author keywords
A. MMCs; B. Thermal properties; C. Delamination; D. DTA SEM
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Indexed keywords
COMPACTION;
COPPER ALLOYS;
COPPER POWDER METALLURGY;
CRACK PROPAGATION;
IRON COMPOUNDS;
METALLOGRAPHIC MICROSTRUCTURE;
MICROCRACKS;
NUCLEATION;
PLASTIC DEFORMATION;
PRESSURE EFFECTS;
REINFORCEMENT;
THERMAL CONDUCTIVITY;
THERMAL EFFECTS;
WEAR RESISTANCE;
SLIDING TESTS;
METALLIC MATRIX COMPOSITES;
ALLOY;
DELAMINATION;
FIBER REINFORCED COMPOSITE;
THERMAL CONDUCTIVITY;
THERMAL PROPERTY;
WEAR;
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EID: 0035655592
PISSN: 02663538
EISSN: None
Source Type: Journal
DOI: 10.1016/S0266-3538(01)00070-7 Document Type: Article |
Times cited : (17)
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References (42)
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