Thermal stress measurement of quartz oscillator module packaging

Acta Mechanica Solida Sinica

Volumn 14, Issue 3, 2001, Pages 251-258

  Ji, Hongwei ^a   Qin, Yuwen ^b   Chen, Jinlong ^b  

^a TIANJIN UNIVERSITY OF COMMERCE   (China)

^b TIANJIN UNIVERSITY   (China)

Author keywords

Digital image correlation method (DICM); Micro zone strain measurement; Quartz oscillator module packaging; Thermal stress

Indexed keywords

EID: 0035649956     PISSN: 08949166     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

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