Intermediate-Frequency/Baseband Analog Processing Chipset for a CDMA/AMPS Mobile Handset

Journal of the Korean Physical Society

Volumn 39, Issue 1, 2001, Pages 160-164

  Shin, Hyunchol ^a,b   Choo, Woo Seung ^a   Nah, Kyung Suc ^a   Keum, Dong Jin ^a   Choi, Jin Sub ^a   Baik, Seung Beom ^a   Ahn, Tae Won ^a   Sohn, Il Young ^a   Jung, Duck Young ^a   Park, Byeong Ha ^a  

^a SAMSUNG Electronics   (South Korea)

^b University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0035620854     PISSN: 03744884     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. Qualcomm Product Data Sheet, Q5312 BBA2, (1995).
2. Samsung Product Data Sheet, KB8653, (1998).
3. K. Nah, T. Ahn, S. Baik, J. Choi, W. Choo, D. Keum, I. Sohn and D. Jung, A 48-pin Minichip Implementation of Baseband Analog Processor for the CDMA Mobile Phones, Proc. of the first IEEE Asia Pacific Conference on ASICs, Korea, Aug. (1999).
4. Qualcomm Product Data Sheet, IFR3000 and IFT3000, (1999).
5. K. Nah, D. Jung, and B. Park, J. Korean Phys. Soc. 37, 808 (2000).
6. Hyunchol Shin, Dong-Jin Keum, Jin-Sub Choi, Duck-Young Jung and Byeong-Ha Park, Highly Linear Variable Gain Amplifiers with Programmable Temperature Compensation for CDMA Wireless Applications, 2000 IEEE International Symposium on Circuits and Systems, Geneva, Switzerland, p. 467, May 2000.