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Journal of Polymer Science, Part B: Polymer Physics

Volumn 39, Issue 23, 2001, Pages 2947-2959

Effect of thermal history on the deformation and failure of polyimides

(3) Lincoln, Jason E a Morgan, Roger J b Eugene Shin, E c

a AIR FORCE RESEARCH LABORATORY (United States)

b Department of Electrical and Computer Engineering (United States)

c NASA GLENN RESEARCH CENTER (United States)

Author keywords

Fracture; Polyimides; Structure property relations

Indexed keywords

ABSORPTION; AGING OF MATERIALS; ANNEALING; CRYSTAL STRUCTURE; DEFORMATION; DEGRADATION; FRACTURE; GLASS TRANSITION; MOISTURE; MORPHOLOGY; TEMPERATURE; THERMOPLASTICS;

FREE VOLUME; POLYOXYDIPHENYLENE PYROMELLITIMIDE; RESIDUAL CRYSTALLINITY; THERMALLY ACTIVATED MICROVOID COLLAPSE;

POLYIMIDES;

EID: 0035576585 PISSN: 08876266 EISSN: None Source Type: Journal
DOI: 10.1002/polb.10043 Document Type: Article

Times cited : (22)

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