Process capability indices and product reliability

Microelectronics Reliability

Volumn 41, Issue 12, 2001, Pages 2067-2070

  Ramakrishnan, Bharatwaj ^a   Sandborn, Peter ^b   Pecht, Michael ^b  

^a ADVANCED MICRO DEVICES   (United States)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FLIP CHIP DEVICES; QUALITY CONTROL; RELIABILITY; SEMICONDUCTOR DEVICES; SOLDERING;

SHEWHART PROCESS CONTROL CHARTS;

PROCESS CONTROL;

EID: 0035575907     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00227-X     Document Type: Article

References (7)

1. Defects tail off with six-sigma manufacturing
2. A review and interpretations of process capability indices
3. Reliability improvements in solder bump processing for flip chips
4. pk