Integration of thin CVD TiSiN barriers in Cu interconnects

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 43-48

  Marcadal, C ^a   Chen, L ^a   Chen, M ^a   Parikh, S ^a   Naik, M ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; DIELECTRIC LOSSES; DIELECTRIC MATERIALS; DIFFUSION; METALLIZING; METALLORGANIC CHEMICAL VAPOR DEPOSITION; PHYSICAL VAPOR DEPOSITION; PLASMA APPLICATIONS; PYROLYSIS; TERNARY SYSTEMS; THIN FILMS; TITANIUM COMPOUNDS;

DIFFUSION BARRIERS;

COPPER;

EID: 0035555478     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)