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Volumn , Issue , 2001, Pages 427-432

Electromigration reliability of Cu/spin-on porous ultra low-k interconnects

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COPPER; CURRENT DENSITY; ELECTROMIGRATION; METALLIZING; PERMITTIVITY; POROSITY; POROUS MATERIALS; SILICA;

EID: 0035555210     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.