Integration of Cu with SiOCH (coral) and SiC:H low k dielectric films in a dual damascene scheme

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 295-299

  Mountsier, Tom ^a   Grief, Malcolm ^a   Goonetilleke, Chevan ^a   Lassig, Steve ^a  

^a Novellus Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHOUS FILMS; CAPACITANCE; COPPER; ELECTRIC WIRE; PERMITTIVITY; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICA; SILICON CARBIDE;

COMB STRUCTURES;

DIELECTRIC FILMS;

EID: 0035555203     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)