Process and thin film characteristics of TaN deposited by MOCVD

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 609-612

  Bilodeau, S M ^a   Vestyck, D J ^a   Ragaglia, C ^a   Stauf, G T ^a   Roeder, J F ^a   Baum, T H ^a  

^a ENTEGRIS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

METALLORGANIC CHEMICAL VAPOR DEPOSITION; REACTION KINETICS; SUBSTRATES; SURFACE REACTIONS; TANTALUM COMPOUNDS;

FILM DEPOSITION;

THIN FILMS;

EID: 0035555053     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)