Development and application of ALD TiN process using batch type ALD equipment system for mass production

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 641-648

  Kwon, Hyug Jin ^a   Kim, Yong Soo ^a   Jin, Won Hwa ^a   Kim, Yil Wook ^a   Kim, Dong Hyun ^a   Park, Sun Dong ^a   Won, Jong Su ^a   Kim, Jeong Soo ^a   Park, Chan Ho ^a   Lee, Won Hyung ^a  

^a Hynix Semiconductor Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CHEMICAL REACTORS; CHEMICAL VAPOR DEPOSITION; ELECTRODES; LEAKAGE CURRENTS; SURFACE ROUGHNESS; TITANIUM NITRIDE;

ATOMIC LAYER DEPOSITION (ALD);

METALLIC FILMS;

EID: 0035554814     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)