A CMP-free Cu/low-k integration technology by Cu pillar/line and ps-low-k STP process

Advanced Metallization Conference (AMC)

Volumn , Issue , 2001, Pages 57-60

  Shishiguchi, S ^a   Fukuda, T ^a   Kochiya, H ^a   Yanazawa, H ^a   Matsunaga, H ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; ELECTROPLATING; HOT PRESSING; PHOTORESISTS; PHOTOSENSITIVITY; SCANNING ELECTRON MICROSCOPY; SPIN COATING;

FILM TRANSFER;

COPPER;

EID: 0035554811     PISSN: 10480854     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)