Microfixtured assembly for lensed optoelectronic receivers

IEEE Transactions on Advanced Packaging

Volumn 24, Issue 4, 2001, Pages 586-589

  Yap, Daniel ^a   Au, Anson ^a   Kendall, Linda K ^a  

^a Hughes Aircraft Co   (United States)

Author keywords

Optical receivers; Optoelectronics; Silicon wafer board

Indexed keywords

MICROFIXTURED ASSEMBLY; OPTOELECTRONIC RECEIVERS; PHOTODETECTOR ARRAY; PHOTODETECTOR CHIP;

ARRAYS; ASSEMBLY; OPTICAL DESIGN; OPTICAL FIBER COUPLING; OPTICAL INSTRUMENT LENSES; OPTOELECTRONIC DEVICES; PHOTODETECTORS; SILICON WAFERS;

ELECTRONICS PACKAGING;

EID: 0035521086     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.982848     Document Type: Article

References (10)

1. Four-channel hybrid receiver using a silicon substrate for packaging
2. RF optoelectronic transitter and receiver arrays on silicon waferboards
3. GaInAsP/InP double-heterostructure planar LEDs
4. Integrated optoelectronic circuits with InP-based HBTs
5. High alignment tolerance coupling scheme for multichannel laser diode/singlemode fiber modules using a tapered waveguide array
6. High efficiency small-size planar hyperbolical lenses
7. Apparatus, assembly and method for making microfixtured, lensed assembly for optoelectronic devices and optical fibers
8. Optoelectronic integration of holograms using (110) oriented silicon on (100) oriented silicon waferboard
9. Anistropic etching of silicon
10. Silicon microlense fabrication