The influence of cross-link density on the creep compliance of an advanced polyimide

Journal of Thermoplastic Composite Materials

Volumn 14, Issue 6, 2001, Pages 477-488

  Nicholson, Lee M ^a   Gates, Thomas S ^a  

^a NASA LANGLEY RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CREEP TESTING; CROSSLINKING; DENSITY (SPECIFIC GRAVITY); GLASS TRANSITION; MOLECULAR WEIGHT; POLYIMIDES; TEMPERATURE; THERMAL EFFECTS; VISCOELASTICITY;

CREEP COMPLIANCE; CROSSLINK DENSITY; TIME TEMPERATURE SUPERPOSITION;

NONMETALLIC MATRIX COMPOSITES;

EID: 0035518139     PISSN: 08927057     EISSN: None     Source Type: Journal    
DOI: 10.1106/CH7V-6PML-91WG-RY50     Document Type: Article

References (11)

1. On the physics required for prediction of long term performance of polymers and their composites
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3. Creep and physical aging in a polymeric composite: Comparison of tension and compression
4. LARC-SI: A soluble aromatic polyimide
5. Processing and properties of IM7/LARC™-SI polyimide composites
6. Effect of crosslink density on the creep behavior of natural rubber vulcanizates
7. The physical properties of bisphenol-A-based epoxy resins during and after curing
8. The physical properties of bisphenol-A-based epoxy resins during and after curing. II. Creep behavior above and below the glass transition temperature
9. The evolution of the viscoelastic retardation spectrum during the development of an epoxy resin system