Planar EM simulation of multi-chip modules and BGA packages

Microwave Journal

Volumn 44, Issue 11, 2001, Pages

  DeLap, Jim ^a  

^a AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY; ELECTROMAGNETIC SIMULATION; INPUT OUTPUT INTERFACE;

COMPUTER SIMULATION; ELECTRIC LINES; ELECTRONICS PACKAGING; INTERFACES (COMPUTER); SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

MULTICHIP MODULES;

EID: 0035518046     PISSN: 01926225     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. Novel 2D photonic bandgap structure for microstrip lines
2. Electromagnetic study of photonic band gaps