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Volumn 24, Issue 13, 2001, Pages 54-56+58+60+62+64+66
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CMP becomes gentler, more efficient
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Author keywords
[No Author keywords available]
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Indexed keywords
COPPER;
COST EFFECTIVENESS;
DELAMINATION;
DEPOSITION;
DIELECTRIC MATERIALS;
ELECTROLYTIC POLISHING;
LITHOGRAPHY;
OPTIMIZATION;
PERMITTIVITY;
PROCESS CONTROL;
PRODUCTIVITY;
RESEARCH AND DEVELOPMENT MANAGEMENT;
BACK END INTEGRATION SCHEME;
DAMASCENCE;
IN SITU PROCESS CONTROL;
PLANARIZATION;
PROCESS OPTIMIZATION OPTIONS;
SCRATCHING POTENTIAL;
CHEMICAL MECHANICAL POLISHING;
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EID: 0035506779
PISSN: 01633767
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (9)
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References (0)
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