Electrothermal model for simulation of bulk-Si and SOI diodes in ESD protection circuits

Microelectronics Reliability

Volumn 41, Issue 11, 2001, Pages 1781-1787

  Wang, Yu ^a   Juliano, Patrick ^a   Joshi, Sopan ^a   Rosenbaum, Elyse ^a  

^a United States of America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT VOLTAGE CHARACTERISTICS; ELECTRIC BREAKDOWN; ELECTRIC EQUIPMENT PROTECTION; MATHEMATICAL MODELS; SEMICONDUCTOR DIODES; SILICON ON INSULATOR TECHNOLOGY;

ELECTROTHERMAL DIODES;

ELECTROSTATICS;

EID: 0035501282     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00034-8     Document Type: Conference Paper

References (7)

1. Heat flow analysis for EOS/ESD protection device design in SOI technology
2. Rigorous thermodynamic treatment of heat generation and conduction in semiconductor device modeling
3. Heat generation in semiconductor devices