The effect of water desorption and organosilane coupling agents on the adhesion of poly(p-xylylene) films to a silicon wafer surface

Journal of Materials Science: Materials in Electronics

Volumn 12, Issue 10, 2001, Pages 581-586

  Lightfoot, P K ^a   Stejny, J ^a  

^a UNIVERSITY OF BRISTOL   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADSORPTION; CRYSTALLIZATION; DESORPTION; SILICON WAFERS; VACUUM APPLICATIONS; WATER;

ORGANOSILANES; VACUUM DESSICATION;

PLASTIC FILMS;

EID: 0035485812     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1012493604054     Document Type: Article

References (23)