Ti3SiC2 as a bonding phase in diamond composites

Journal of Materials Science Letters

Volumn 20, Issue 19, 2001, Pages 1783-1786

  Jaworska, L ^a   Szutkowska, M ^a   Morgiel, J ^b   Stobierski, L ^c   Lis, J ^c  

^a Institute of Metal Cutting   (Poland)

^b INSTITUTE OF METALLURGY AND MATERIALS SCIENCE   (Poland)

^c AGH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; DENSIFICATION; DIAMONDS; ELECTRON DIFFRACTION; ENERGY DISPERSIVE SPECTROSCOPY; HARDNESS TESTING; POLYCRYSTALLINE MATERIALS; SINTERING; TITANIUM ALLOYS; TRANSMISSION ELECTRON MICROSCOPY; WEAR RESISTANCE;

POLYCRYSTALLINE DIAMOND COMPACTS (PCD);

COMPOSITE MATERIALS;

EID: 0035484874     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1012535100330     Document Type: Article

References (10)