Stress analysis around DSCu/SS316 HIP bonded interface

Fusion Engineering and Design

Volumn 56-57, Issue , 2001, Pages 385-389

  Kikuchi, S ^a   Nomura, Y ^b   Saito, M ^b  

^a All Nippon Airways   (Japan)

^b UNIVERSITY OF TSUKUBA   (Japan)

Author keywords

DSCu SS316; High temperature; HIP bonded; Stress intensity factor

Indexed keywords

ALUMINA; COMPUTER SIMULATION; CRACK PROPAGATION; FRACTURE TOUGHNESS; HIGH TEMPERATURE EFFECTS; HOT ISOSTATIC PRESSING; INTERFACES (MATERIALS); SCANNING ELECTRON MICROSCOPY; STRESS ANALYSIS; STRESS INTENSITY FACTORS;

PLASMA FACING COMPONENTS;

EXPERIMENTAL REACTORS;

EID: 0035484087     PISSN: 09203796     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0920-3796(01)00336-2     Document Type: Article

References (4)

1. M. Goto, M. Uno, M. Saito, T. Hatano, Fracture strength of DS-Cu/316SS HIP bonded structure, Proc. 20th SOFT, Marseille, France, 1998, pp. 177-180.
2. T. Hatano, Study on Thermal and Mechanical Performance of First Wall Fabricated by Hot Isostatic Pressing Method for Fusion Experimental Reactors, Doctorial Thesis, Univ. of Tsukuba, March 2000.
3. M. Kanari et al., Characterization of HIP Bonded DS-Cu/ SS316L Joints for Fusion Experimental Reactors, JAERI-Research 98-004, 1998.
4. Yuki, R., 'Mechanics of Interface', in Japanese, Tokyo, Baifu-kan, 1993, ch. 4.