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Microelectronics Journal

Volumn 32, Issue 10-11, 2001, Pages 863-868

Fuzzy thermal modeling for MCM placement

(4) Huang, Yu Jung a Fu, Shen Li a Jen, Sun Lon a Guo, Mei Hui b

a I SHOU UNIVERSITY (Taiwan)

b NATIONAL SUN YAT SEN UNIVERSITY (Taiwan)

Author keywords

Fuzzy; Multichip module; Placement

Indexed keywords

ALGORITHMS; ENERGY DISSIPATION; FINITE ELEMENT METHOD; FUZZY SETS; HEURISTIC METHODS; MATHEMATICAL MODELS; TEMPERATURE DISTRIBUTION; THERMOANALYSIS;

THERMAL MODELING;

MULTICHIP MODULES;

EID: 0035480142 PISSN: 00262692 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2692(01)00074-X Document Type: Article

Times cited : (11)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.