Effect of two relative humidity environments on the performance properties of MDF, OSB and chipboard. Part 1. MOR, MOE and fatigue life performance

Wood Science and Technology

Volumn 35, Issue 5, 2001, Pages 395-403

  Pritchard, J ^a   Ansell, M P ^a   Thompson, R J H ^a   Bonfield, P W ^a  

^a University of Bath   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC MODULI; FATIGUE OF MATERIALS; STIFFNESS; STRUCTURAL LOADS; WOOD PRODUCTS;

CREEP LOADING;

STRUCTURAL PANELS;

CHIP BOARDS; FLAKES; RUPTURE MODULUS;

EID: 0035473563     PISSN: 00437719     EISSN: None     Source Type: Journal    
DOI: 10.1007/s002260100104     Document Type: Article

References (14)

1. Fatigue life and design stresses for wood composites in furniture
2. Fatigue and creep of chipboard. Part 1, Fatigue at R = 0.01
3. Slow cyclic fatigue of chipboard
4. Creep research on particleoard
5. Fatigue and creep in chipboard. Part 2: The influence of slow cyclic fatigue on the creep behaviour of chipboard at a range of stress levels and moisture contents
6. Investigations into dimensional stability of MDF and particleboards
7. Performance of oak strip flooring systems under changing environmental conditions
8. Comparative shear strength of seven types of wood composite panels at high and medium relative humidity conditions
9. Understanding the fatigue and creep properties of MDF, OSB and chipboard using environmental scanning electron microscopy and x-ray densitometry
10. Bending fatigue strength of particleboard
11. Fatigue and creep of chipboard. Part 3: The effect of frequency
12. Effects of environmental factors on the properties of particleboard 1. Effects of temperature on bending properties