Heat transfer by impingement circular jet and immersion cooling of L12378

Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University

Volumn 35, Issue 9, 2001, Pages 958-961

  Zhou, Dingwei ^a   Ma, Chongfang ^a   Liu, Dengying ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Heat transfer; Jet impingement; Simulated microelectronic chip

Indexed keywords

HEAT FLUX; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; MICROPROCESSOR CHIPS; REGRESSION ANALYSIS;

IMMERSION COOLING; IMPINGEMENT CIRCULAR FREE SURFACE JET; SIMULATED MICROELECTRONIC CHIP;

JETS;

EID: 0035453551     PISSN: 0253987X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)

1. Wall superheat excursions in the boiling incipience of dielectric fluids
2. Wall roughness effects on stagnation point heat transfer beneath an impinging liquid jet
3. Liquid jet impingement heat transfer with or without boiling
4. Analytical study on impingement heat transfer with single phase free surface circular liquid jets
5. Dependence of local Nusselt number on Prandtl number in the case of free convection along a vertical surface with uniform heat flux