Flattening ability of a vacuum pin chuck around the periphery of a processed wafer

Microelectronic Engineering

Volumn 57-58, Issue , 2001, Pages 49-57

  Une, A ^a   Kai, Y ^a   Mochida, M ^a   Matsui, S ^b  

^a NATIONAL DEFENSE ACADEMY   (Japan)

^b NTT CORPORATION   (Japan)

Author keywords

Chucking accuracy; Flattening; Pin chuck; Wafer flatness

Indexed keywords

CHUCKS; EXCIMER LASERS; FINITE ELEMENT METHOD; PHOTOLITHOGRAPHY; ULTRAHIGH VACUUM; WSI CIRCUITS;

VACUUM PIN CHUCK; WAFER FLATNESS;

MICROELECTRONIC PROCESSING;

EID: 0035450770     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(01)00428-2     Document Type: Article

References (1)