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Volumn 18, Issue 7, 2001, Pages 36-40+42

The SDM test method: Past, present, and future

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; COMPUTER SIMULATION; ELECTRIC CONNECTORS; ELECTRIC DISCHARGES; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONICS PACKAGING; ELECTROSTATICS; INDUCTANCE; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; WAVEFORM ANALYSIS;

EID: 0035448366     PISSN: 08983577     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article
Times cited : (3)

References (16)
  • 6
    • 0003678591 scopus 로고    scopus 로고
    • ESD association work in progress for electrostatic discharge (ESD) sensitivity testing-charged-device model (CDM)-component level
    • EOS/ESD-CDM-WIP5.3-1994; ESD Association, Rome, NY
  • 8
    • 0003523407 scopus 로고
    • Failure thresholds and failure signatures for the same device in different packages using socketed and non-socketed CDM simulators
    • WG 5.0 Report (Rome, NY: ESD Association)
    • (1995)
    • Henry, L.G.1
  • 9
    • 0030273996 scopus 로고    scopus 로고
    • Reproducibility of field failures by ESD models-comparison of HBM, socketed CDM and non-socketed CDM
    • (Oxford, UK: Elsevier Science)
    • (1996) Microelectronics Reliability , vol.36 , Issue.11-12 , pp. 1719-1722
    • Brodbeck, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.